Purpose	The die bonder provides sub-micron precision die attach and advanced flip-chip packaging capabilities
Location	RPF Cleanroom
Material systems	Epoxy / adhesive; formic acid; thermo-compression; thermo-sonic bonding
Scale / volume	Heated stage accommodates up to 50mm x 50mm samples; maximum chip size for the bonder pick is 15mm x 15mm
Specs / resolution	Precision placement and alignment; thermo compression; ultrasonic or thermosonic bonding, formic acid, adhesive dispense module