Syenta Raises $26M in Series A Funding for AI Chip Connectivity

Syenta, a NSW-based start-up and ANFF-NSW client, has raised US$26M in Series A funding to accelerate chip-to-chip connectivity for next-generation AI systems.

Led by Playground Global and Australia’s National Reconstruction Fund, this brings our total funding to US$36M+. Former Intel CEO Pat Gelsinger is also joining Syenta’s Board of Directors.

As AI scales, advanced packaging is becoming the bottleneck. Syneta’s proprietary Localized Electrochemical Manufacturing (LEM) technology enables higher-density interconnects, improved performance, and ~40% fewer process steps, all within existing manufacturing infrastructure. Syenta is also expanding into Arizona to collaborate more closely with customers and partners across the U.S. semiconductor ecosystem.

Source: LinkedIn,