CUP Project Priority Survey Please rate each of the awarded CUP items below on a scale of 1 to 4 (1 = highest priority, 4 = lowest priority). Personal InformationName First Last Email Highest priority (1)AFM1234Direct write maskless lithography system1234Pascal dual chamber laser-MBE system WP1: major laser services1234Comment (optional)Upper mid-range priority (2)IBS IMC200 implanter: deceleration unit to allow implants 2-20 kV1234In-process metrology: microscopes/profilometers1234Plasma asher/etcher1234Veeco III-V MBE system: replacement of spares used to maintain the MBE tool1234STS DRIE clean-Si Bosch-process: Major overhaul and maintenance to existing STS DRIE system (including turbo Pump, roughing pump, load lock pump, & chuck)1234Pascal dual chamber laser-MBE system WP4: addition of highpressure RHEED capability1234Comment (optional)Lower mid-range priority (3)Oxford Plasmalab 100 RIE, clean Si processes WP1: Major pump overhaul to maintain process integrity1234Oxford Plasmalab 100 PECVD: pump overhaul1234Bench top ALD system (2 source)1234Pascal dual chamber laser-MBE system WP3: replacement of spares1234Oxford Plasmalab 100 RIE, clean Si processes WP2: Add endpoint detection for in-situ etch depth monitoring for more reliable process control1234Small-field Electron Beam (EBL) Lithography system1234RIE tool with ICP capability to replace ageing HC-RIE and add new ICP capability1234Small-field Electron Beam (EBL) Lithography system1234Pascal dual chamber laser-MBE system WP2: major pump services1234Comment (optional)Lowest priority (4)PVD ebeam and thermal evaporator1234West lab RO/DI water system1234Boron diffusion tube furnace1234Clean annealing tube furnace (MOS)1234Clean Si oxidation tube furnace1234Phophorus diffusion tube furnace1234UDOX ultra-clean Si oxidation furnace1234IBS IMC200 implanter: pump overhaul to maintain process integrity.1234Comment (optional)Section Break
