Purpose |
A photolithography tool that supports top and back sides mask alignment and can pattern with feature size in micron; vacuum contact, soft contact, proximity exposure modes |
Location |
Photo-Lithography Bay, RPF Cleanroom |
Material systems |
Photomasks and photoresist-coated substrates |
Scale / volume |
Photomask sizes: 4 inch, 5 inch, and 7 inch; substrate size: 2 inch, 4 inch, and 6 inch |
Specs / resolution |
Vacuum contact: 1 – 1.5um; soft contact: 1.5 – 3um; proximity: >3um |
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* Not an ANFF-supported tool; access is available – refer to Access Fees schedule |