Purpose	A spindle dicing system that offers customizable and/or full-automatic dicing solution
Location	RPF Lab 3021
Material systems	Wafers, silicon, glass, ceramic
Scale / volume	Capable of cutting semiconductor wafers, silicon, glass, ceramic up to 6 inches
Specs / resolution	High accuracy up to 1µm
	* Not an ANFF-supported tool; access is available – refer to Access Fees schedule