Purpose: non-directional deposition of a range of metals (multi-target)
Location: West Grey Area
Material systems: Approved target materials – Ti, Al, Cr, Au, Cu, TiO2, ZnO, SiO2, W, Nb, ITO, Evanohm. Other materials by prior approval.
Scale/volume: Single wafer.
Specifications/resolution: Five target positions; 600W rf power supply; 2kW DC power supply; heated rotary work holder (290mm diameter, to 400C), Ar, O2 and N2 processing gases, co-sputtering