Purpose	A compact reactive ion etching tool
Location	Plasma Etch & Deposition Bay, RPF Cleanroom
Material systems	Available gases are SF6, CF4, CHF3, supported with argon, oxygen, helium and nitrogen
Scale / volume	Accommodates 6 inch wafers
Specs / resolution	Optical emission spectroscopy endpoint detection
	* Not an ANFF-supported tool; access is available – refer to Access Fees schedule