Metrology

3D Microscope Leica DCM8 *

Purpose A metrology tool that leverages four optical modalities to image 3D topology and thin film/s properties with high automation
Location Metrology Bay, RPF Cleanroom
Scale / volume This microscope can accommodate samples up to 150mm diameter and 20cm in height, 3D topology mapping is limited to within a 40mm Z-range.
Specs / resolution 3D topography can be mapped at a resolution down to ≈300nm in the XY plane and less than 1 nm in Z; modalities consist of confocal, three variants of interferometry, focal plane mapping, and reflectometry
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

4-point Probe

Location UNSW – Upper East Lab (White Area)
Substrates types allowed Any
Substrate sizes 30 mm x 30 mm to 2”
Probes Four-point probe
Output Sheet resistance for given current

Atomic Force Microscope Bruker Icon *

Purpose A metrology tool that measures micron to sub-nanometre surface topology and material properties with nanometre sharp mechanical probes
Location Metrology Bay, RPF Cleanroom
Scale / volume This tool can accommodate 200mm wafers; maximum imaging area is 90 x 90 µm with a maximum Z-range of 10 µm
Specs / resolution The resolution limit is dependent on sample and technique though generally on the order of few nm in XY and below 1nm in Z; many properties can be measured / investigated including topology, conductivity, capacitance, modulus, adhesion, etc.
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Bruker Dimension Edge AFM

Location UNSW – Lower East Lab (White Area)
X-Y Scan Range 90μm x 90μm typical, 85μm minimum
Z Range 10μm typical
Vertical Noise Floor <50pm RMS
Sample/Size/Holder 150mm vacuum chuck, 15mm thick
Scanning modes ScanAsyst, Tapping, Contact

Cascade Probe Station

Location UNSW – South Lab (Test Area)
Model Keithley Semiconductor Characterization system (4200SCS/C)
Available options CV unit (4210-CVU),

Remote Preamp Option (4200-PA),

Medium power SMU x 2 (4200-SMU),

SMA to SSMC Dual with Local Ground (4200-PRB-C)

Dektak 150

Location UNSW – West Lab (White Area)
Scan Length Range 55 mm
Data Points Per Scan 60,000 maximum
Max. Sample Thickness Up to 100 mm
Max. Wafer Size 150 mm
Height Repeatability 6Å, 1 sigma on 1 μm step
Vertical Range 524 μm
Vertical Resolution 1 Å max. (at 6.55 μm range)
Stylus Force 1 – 15 mg
Sample Viewing 640 x 480-pixel (1/3 in.-format) camera, USB; fixed magnification, 2.6 mm FOV (166X with 17 in. monitor)
Sample Stage Manual X/Y/Θ, 100 x 100 mm X-Y translation,360° rotation, manual levelling
Stylus radius 6.5 µm

Dektak 2A

Location UNSW – West Lab (Grey Area)
Sample size From small chips up to 4”
Max Scan Length 30mm
Max depth 30 micron

Dektak 3030

Location UNSW – Lower East Lab (White Area)
Sample stage diameter 165 mm
Max sample thickness 45 mm
Max sample weight 0.5 kg
Stylus tracking force 1 – 40 mg
Sample stage translation X Axis, +76mm (from center); Y Axis, 76mm
Sample stage rotation Theta = 360°
Z – resolution 1A/65 kÅ; 10A/655 kÅ; 20A/1310 kÅ
Leveling Manual, 2-point or cursor levelling
Stylus diameter 12.5 µm

Ellipsometer JA Woollam M2000 *

Purpose A metrology tool that measures the thickness & refractive index of thin films and multi-layered films using polarised light
Location Plasma Etch & Deposition Bay, RPF Cleanroom
Material systems Thin films
Scale / volume Small samples to 6 inch wafers
Specs / resolution Measurement wavelength ranges from 200nm to 1000nm
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

FIB-SEM Zeiss Crossbeam 550XL *

Purpose A multi-purpose platform that enables advanced Scanning Electron Microscopy imaging and analysis as well as Focus Ion Beam milling & deposition for cross-section profile inspection and other applications
Location E-beam Bay, RPF Cleanroom
Material systems It is fitted with options for elemental analysis, plasma cleaning, beam directed deposition and physical / chemical etching, diffraction based structural analysis, nano / micro manipulation, and electrical probing
Scale / volume Imaging of non-conductive materials; elemental & crystallographic analysis and mapping @ ≥ 5nm; can accommodate samples as large as 150 mm wafers and 7 inch masks; 2nm image resolution; 4-10nm milling, etching, deposition
Specs / resolution The FIB-SEM is a very versatile high performance tool for macro / micro / nano imaging, analysis, fabrication, manipulation, and characterisation; full analysis of any sample; in-situ milling / circuit edit / device modifications; metrology; charge compensated imaging and milling imaging; cross-sectioning; transmission imaging
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Microscope Nikon Eclipse LV100ND

Purpose A manual upright optical microscope with NIS Software and UV source
Location Metrology Bay, RPF Cleanroom
Scale / volume Can accommodate up to 150mm wafers
Specs / resolution Combined reflectance / transmitted illumination with brightfield, darkfield, DIC, fluorescence, polarising, and phase-contrast; resolution limit is ≈300nm

NanoFab Helium Ion Beam Zeiss *

Purpose A metrology and fabrication tool that enables imaging and fabrication at resolutions below what is possible in scanning electron microscopes
Location RPF HIM Suite
Scale / volume Sample sizes are limited to 50mm diameter and 30mm height
Specs / resolution It is fitted with components for imaging non-conductive materials, nanoscale milling / deposition, and circuit editing; image resolution is ≈0.5nm, with ultimate limits of ≈1.5nm to 5 µm for milling / deposition
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Olympus BH2 Microscope

Location UNSW – Lower East Lab (White Area)
Sample size From small chips up to 4”
Objective magnifications 5X, 10X, 20X, 50X, 100X
Features Nomarski DIC Prism available on 50X objective

Olympus BX51 Phase Contrast & Darkfield Microscope

Location UNSW – West Lab (White Area)
Sample size From small chips up to 4”
Objective magnifications 5X, 10X, 20X, 50X, 100X
Features Darkfield & Phase Contrast

Optical Microscopes Olympus DSX 510 *

Purpose A semi-automated upright digital optical microscope with LED light source
Location Metrology Bay, RPF Cleanroom
Scale / volume Can accommodate up to 150mm wafers with 100mm x 100mm addressable area
Specs / resolution Reflectance illumination with brightfield, darkfield, DIC, and polarising; resolution limit is ≈300nm
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Olympus DSX1000 Digital Microscope

Location UNSW – West Lab (Grey Area)
Features BrightField, Oblique Illumination, Darkfield, MIX Illumination, Polarization, Differential Interference Contrast
Motorized XY stage, Tilting Frame including motorized Z
Avail. Magnifications Zoom 140X-1400X, 30mm working distance, N,A. 0.3
Zoom 560X-5600X, 4.5 working distance, N.A. 0.8
Zoom 42-420X (long working distance)

Stylus Profilometer DekTak XT *

Purpose The Dektak XT profilometer is a stylus profiler capable of measuring step heights, film stress, and surface roughness
Location Metrology Bay, RPF Cleanroom
Scale / volume Can accommodate up to 150mm wafers
Specs / resolution This tool is generally used for measuring 2D profiles and has a 0.1nm vertical resolution
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

J A Woollam spectroscopic ellipsometer

Location UNSW – West Lab (Grey Area)
Modes Spectral ellipsometry, transmission measurements
Wavelength range 200 – 1000nm
Spot size 3x3mm
Stage No scanning
Wafer size Small chips up to 6”
Software WASE, Complete EASE