Purpose | A spindle dicing system that offers customizable and/or full-automatic dicing solution |
Location | RPF Lab 3021 |
Material systems | Wafers, silicon, glass, ceramic |
Scale / volume | Capable of cutting semiconductor wafers, silicon, glass, ceramic up to 6 inches |
Specs / resolution | High accuracy up to 1µm |
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule |
Packaging
Dicing Saw ADT 7122 *
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-usyd-1.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/10/RPF_Packaging_Dicing-Saw1-600x600.jpg)
Die Bonder Fine Tech Lambda
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-usyd-1.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/10/RPF_Packaging_Die-Bonder1-600x600.jpg)
Purpose | The die bonder provides sub-micron precision die attach and advanced flip-chip packaging capabilities |
Location | RPF Cleanroom |
Material systems | Epoxy / adhesive; formic acid; thermo-compression; thermo-sonic bonding |
Scale / volume | Heated stage accommodates up to 50mm x 50mm samples; maximum chip size for the bonder pick is 15mm x 15mm |
Specs / resolution | Precision placement and alignment; thermo compression; ultrasonic or thermosonic bonding, formic acid, adhesive dispense module |
Electrical Probe Station Suss PM 5
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-usyd-1.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/10/RPF_Packaging_Electrical-Probe-Station3-600x600.jpg)
Purpose | 4 probe DC probe station for measuring electrical properties of materials and devices |
Location | RPF Lab 3021 |
Scale / volume | Substrate size up to 6 inch wafer |
Specs / resolution | Can heat substrate up to 120°C during measurement |
F&S Bondtech 53XX BDA Bonder
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-unsw-1-9.14.24-am.png)
![](https://www.anff-nsw.org/wp-content/uploads/2022/08/F-and-S-bonder-600x600.jpg)
Location | UNSW – South Lab (Test Area) |
Configuration | 25 μ |
Bondhead Z: | 60mm; step of 1 μm |
Standard work height | 70mm |
Manipulator in X and Y: | 18x18mm complies |
Two-channel ultrasonic generator | 100-105 kHz 2.5 – 5 W |
Wire guide | 90 °, 2 “wire coil |
K and S Al Wedge Bonder
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-unsw-1-9.14.24-am.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/KS-Al-wedge-bonder-600x600.jpg)
Location | UNSW – South Lab (Test Area) |
Wire material | Al, 25 microns diameter |
Bonding modes | 45 deg, manual, semi-automatic (Z-axis) |
Karl Suss Manual Wafer Scriber
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-unsw-1-9.14.24-am.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/Custom-scriber-600x600.jpg)
Location | UNSW – Upper East Lab (White Area) |
Wafer size | Small pieces up to 100 mm |
Scriber tip | Diamond tip |
TPT HB10 Thermosonic Au Ball Bonder
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-unsw-1-9.14.24-am.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/TPT-HB10-600x600.jpg)
Location | UNSW – South Lab (Test Area) |
Wire material | Au, 25 microns diameter |
Bonding modes | Manual, semi-automatic (Z-axis) |
Options | Laser marker, video camera |
Wire Bonder TPT HB 100 *
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-usyd-1.png)
![](https://www.anff-nsw.org/wp-content/uploads/2020/10/RPF_Packaging_Wire-Bonder1-600x600.jpg)
Purpose | The TPT wire bonder is capable of performing automatic and semi-automatic wire bonding with gold and aluminium wires |
Location | RPF Lab 3021 |
Material systems | Samples on PCB |
Specs / resolution | Capable of manual, semi-auto and auto mode; wedge and ball bonding; deep access bond head |
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule |
Disco DAD3240 dicing saw
![](https://www.anff-nsw.org/wp-content/uploads/2020/09/logo-unsw-1-9.14.24-am.png)
![](https://www.anff-nsw.org/wp-content/uploads/2015/10/DISCO-dicing-saw-600x600.jpg)
Location | UNSW – Lower East Lab (Grey Area) |
Table size | 8″ |
Maximum wafer size | 6″ |
Available blades | Si with 0.8mm exposure, and 0.035mm kerf |
Si with 1.1 mm exposure, and 0.06mm kerf | |
Glass up to 2mm thick with 0.2mm kerf | |
Sapphire up to 2mm with 0.2mm kerf | |
Quartz up to 2mm with 0.15mm kerf |