Packaging

Dicing Saw ADT 7122 *

Purpose A spindle dicing system that offers customizable and/or full-automatic dicing solution
Location RPF Lab 3021
Material systems Wafers, silicon, glass, ceramic
Scale / volume Capable of cutting semiconductor wafers, silicon, glass, ceramic up to 6 inches
Specs / resolution High accuracy up to 1µm
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Die Bonder Fine Tech Lambda

Purpose The die bonder provides sub-micron precision die attach and advanced flip-chip packaging capabilities
Location RPF Cleanroom
Material systems Epoxy / adhesive; formic acid; thermo-compression; thermo-sonic bonding
Scale / volume Heated stage accommodates up to 50mm x 50mm samples; maximum chip size for the bonder pick is 15mm x 15mm
Specs / resolution Precision placement and alignment; thermo compression; ultrasonic or thermosonic bonding, formic acid, adhesive dispense module

Electrical Probe Station Suss PM 5

Purpose 4 probe DC probe station for measuring electrical properties of materials and devices
Location RPF Lab 3021
Scale / volume Substrate size up to 6 inch wafer
Specs / resolution Can heat substrate up to 120°C during measurement

K and S Al Wedge Bonder

Location UNSW – South Lab (Test Area)
Wire material Al, 25 microns diameter
Bonding modes 45 deg, manual, semi-automatic (Z-axis)

Karl Suss Manual Wafer Scriber

Location UNSW – South Lab (Test Area)
Wafer size Small pieces up to 100 mm
Scriber tip Diamond tip

TPT HB10 Thermosonic Au Ball Bonder

Location UNSW – South Lab (Test Area)
Wire material Au, 25 microns diameter
Bonding modes Manual, semi-automatic (Z-axis)
Options Laser marker, video camera

Wire Bonder TPT HB 100 *

Purpose The TPT wire bonder is capable of performing automatic and semi-automatic wire bonding with gold and aluminium wires
Location RPF Lab 3021
Material systems Samples on PCB
Specs / resolution Capable of manual, semi-auto and auto mode; wedge and ball bonding; deep access bond head
* Not an ANFF-supported tool; access is available – refer to Access Fees schedule

Disco DAD3240 dicing saw

Location UNSW – West Lab (Grey Area)
Table size 8″
Available blades Si with 0.8mm exposure, and 0.035mm kerf
Si with 1.1 mm exposure, and 0.06mm kerf
Glass up to 2mm thick with 0.2mm kerf
Sapphire up to 2mm with 0.2mm kerf
Quartz up to 2mm with 0.15mm kerf